Core trends! New business opportunities! 5G/RF and much more!

This year's ELEXCON exhibition will be held in Halls 1 and 9, with a total of 45000 square meters and more than 400 exhibitors, focusing on the four core themes: automotive grade chips & components,  embedded & AIoT, SiP & advanced packaging, and localized components. 

We will be waiting for you at booth 1L62.

Looking forward to your arrival!

Date: 6~8 November

Venue: Shenzhen Convention and Exhibition Center (Futian), Halls 1 & 9

Booth: 1L62