Fine Leak

Leak rate less than 2*10-8 atm.cc/sec

MIL-STD-883 1014

Gross Leak

Leak rate less than 2*10-4 atm.cc/sec

MIL-STD-883 1014

Thermal Shock

-55℃, 125℃; soak time is 10 mins,  with total 200 cycles

MIL-STD-883 1010 Condition B

Damp Heat

85℃/85% RH for   500 hrs

JESD22-A101

Low Temp Storage

-40℃ for 500   hrs-40℃ for 500 hrs

IEC 60068-2-1

Aging

25℃, 85℃, 125℃, test in period of
  1, 2, 4, 7, 10, 20, 50, 100 days

MIL-STD-883 1005 Condition A or B

MIL-STD-883   1008 Condition B

Soldering Heat

(Metal Can)

260 ± 5℃ for 10 ± 1   sec260 ± 5℃ for 10 ± 1 sec

MIL-STD-202 210 Condition B

IR Reflow
  (SMD)

Pre-heating: 150℃ to 200℃, 60~120secs.
  Heating: 217℃, 60~150secs.
  Peak: 260±5℃, 25±5secs. Go through twice.

J-STD-020D

Solderability

First procedure:
  Steam Aging 93℃ +3/-5,
  8 ± 0.5hrs.
  And then:
  Dipping 245±5℃ , 5 ± 0.5sec.

JESD22-B102

Mechanical Shock

1500g, half-sine, duration: 0.5ms,   each axis for 3 times

MIL-STD-883 2002 Condition B

Vibration Test

10~2000Hz, 1.52mm, 20g, each axis for   4 hrs

MIL-STD-883 2007 Condition A

Salt Spray

35 ± 2℃, 5% salt   spray for 96 hrs

MIL-STD-883H
  1009.8 condition C
  IEC 60068-2-11

Bump Test

40g / 6ms ,each axis for 4000 times.

IEC 60068-2-29

Drop Test

70, 80, 90cm, each height for 3 times on a hardboard

IEC 60068-2-32

Bend Test

Deflection: 3mm for 30 sec

IEC 60068-2-21

Push Test

10N for 10 sec

IEC 60068-2-21

Press Test

10N for 10 sec

IEC 60068-2-21

Tensile Force

10N for 10 sec

IEC 60068-2-21